Product name: Rigid resin Curing wavelength:405nm
Flexural modulus: 1.882-2.385 MPa Flexural strength: 59-70Mpa
Thermal distortion tempeature: 100℃ Thermal expansion coefficient: 97*E-G
Volume shrinkage: 3.72~4.24% 3.72~4.24% Linear shrinkage: 1.05~1.35%
Tensile strength: 36~52Mpa Temsile modulus: 1.779~2.385MPa
Tensile strain at break: 11%~20% Shore hardness: 890~85D
Glass transition temperature: 105℃ Density after curing: 1.09~1.18g/㎤
Notched impact strength: 44~48j/m Optimum storage temperature: 20℃~25℃
Liquid density: 1.05~1.25g/㎤ 25℃/densitometer
Liquid viscosity: 150~250Mpa · s25℃/rotational vuscometer